JPH0741178Y2 - 厚膜混成集積回路基板 - Google Patents
厚膜混成集積回路基板Info
- Publication number
- JPH0741178Y2 JPH0741178Y2 JP1989035584U JP3558489U JPH0741178Y2 JP H0741178 Y2 JPH0741178 Y2 JP H0741178Y2 JP 1989035584 U JP1989035584 U JP 1989035584U JP 3558489 U JP3558489 U JP 3558489U JP H0741178 Y2 JPH0741178 Y2 JP H0741178Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- chip component
- circuit board
- thick film
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000002003 electrode paste Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989035584U JPH0741178Y2 (ja) | 1989-03-30 | 1989-03-30 | 厚膜混成集積回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989035584U JPH0741178Y2 (ja) | 1989-03-30 | 1989-03-30 | 厚膜混成集積回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02127059U JPH02127059U (en]) | 1990-10-19 |
| JPH0741178Y2 true JPH0741178Y2 (ja) | 1995-09-20 |
Family
ID=31541065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989035584U Expired - Lifetime JPH0741178Y2 (ja) | 1989-03-30 | 1989-03-30 | 厚膜混成集積回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741178Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5929068U (ja) * | 1982-08-18 | 1984-02-23 | 富士通株式会社 | チツプ型部品の位置決め構造 |
| JPS59158334U (ja) * | 1983-04-07 | 1984-10-24 | 三菱電機株式会社 | 回路部品 |
-
1989
- 1989-03-30 JP JP1989035584U patent/JPH0741178Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02127059U (en]) | 1990-10-19 |
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